Dyan

A Precision

Grinding Equipment

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    Application in

    • Semiconductor
    • Optics
    • Measurement
    • Sealing
    • Mechanism
    • Electronic Device
    • Medical
    • Vehicle
    • Energy

    Sample Records

    • Wafering Samples
    • Single Sided Lapping and Polishing Samples
    • Double Sided Lapping and Polishing Samples
  • Products
    • Wafering Machine
      • Fully Automatic Wafer Wax Moun
      • Fully Automatic Wafer Edge Gri
      • Semi Automatic Wafer CMP Machi
      • Wafer Lapping and Polishing Ma
      • Fully Automatic Wafer Grinding
      • Fully Automatic Wafer Grinder
    • Optics Surfacing
      • Lab/Light Lapping and Polishin
      • Six-Axis Airbag Optical Polish
      • Single-point Diamond Turning M
      • Twin Spindle Optical Grinding
    • Lapping and Polishing
      • Advanced Double Sided Lapping
      • Standard Double Sided Lapping
      • Heavy Lapping and Polishing Ma
    • Tools & Consumables
      • Wafer Grinding Wheels
  • Updates & Insights

    Company News

    IMPORTANT: Adjustment to After

    Technique Edge

    Application of High Pressure C

    “Wafer Dicing” – Why Add “Dici

    How Does Temperature Affect th

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Dyan

Dyan Precision Technology

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Dyan

Dyan Precision

  • info@pondax.com
  • +86 (138) 2321-9091
  • Ponda Industrial Park Yuanshan Industrial Zone B Guangming, Shenzhen China 518106

Company

  • About Us
  • Factory Insights
  • Company Story
  • Honors and Certificate
  • Partner with Diyan

Products

  • Wafering Machine
  • Optics Surfacing
  • Lapping and Polishing
  • Tools & Consumables

Support

  • Contact
  • Technical FAQs
  • Commercial FAQs

Sample Records

  • Wafering Samples
  • Single Sided Lapping and Polishing Samples
  • Double Sided Lapping and Polishing Samples

Application

  • Semiconductor
  • Optics
  • Measurement
  • Sealing
  • Mechanism
  • Electronic Device
  • Medical
  • Vehicle
  • Energy
  • Contact us for more

Technique Edge

Application of High Pressure C

“Wafer Dicing” – Why Add “Dici

How Does Temperature Affect th

Company News

IMPORTANT: Adjustment to After

Legal and Policy

  • Privacy Policy
  • Terms of Conditions
  • Cookie Policy
  • Disclaimer

© 2024 Shenzhen Dyan Precision Technology Company Co., Ltd. All Rights Reserved.
DYAN GRINDING™ is a registered trademark of Shenzhen Ponda Grinding Technology Company Limited, P.R.China and other countries. 
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  • About Us
  • Application
  • Products
    • Wafering Machine
      • Fully Automatic Wafer Wax Moun
      • Fully Automatic Wafer Edge Gri
      • Semi Automatic Wafer CMP Machi
      • Wafer Lapping and Polishing Ma
      • Fully Automatic Wafer Grinding
      • Fully Automatic Wafer Grinder
    • Optics Surfacing
      • Lab/Light Lapping and Polishin
      • Six-Axis Airbag Optical Polish
      • Single-point Diamond Turning M
      • Twin Spindle Optical Grinding
    • Lapping and Polishing
      • Advanced Double Sided Lapping
      • Standard Double Sided Lapping
      • Heavy Lapping and Polishing Ma
    • Tools & Consumables
      • Wafer Grinding Wheels
  • Updates & Insights
  • Support
  • Contact