Wafer Lapping and Polishing Machine
The Wafer Lapping and Polishing Series primarily used for planarization and CMP polishing of semiconductor materials such as sapphire wafers and substrates. To further control the surface geometry of wafer accurately, the series of equipment incorporates in-process EPD system to control the distribution of processing pressure. Additionally, we have equipped this series with a temperature control system. This is to maintain the abrasive materials and liquids at a stable processing temperature, while also reducing thermal deformation of the abrasive disc that could affect processing precision.
Engineering Intents
The equipment framework is configurable to support either lapping or polishing
Water-chilling system for temperature control of lapping and polishing discs
4 independently controlled lapping or polishing stations
Configurable with an EPD detection system
Configurable with multiple-pressure-zone air bag platen
Configurable with dual-platen oscillating unit
Specifications
Machine Model | PDS 7004 CP | PDS 8554 CP | PDS 1270 CP | |
|---|---|---|---|---|
Lapping/Polishing Disc Diameter | mm | 700 | 855 | 1270 |
Max. Diamater of Workpiece | mm | 305 | 360 | 485 |
Number of Workstations | mm | 4 | ||
Disc Rotation Rate | rpm | 0 - 120 | 0 - 80 | |
Platen Spindle Rotation Rate | rpm | 0 - 60 | 0 - 45 | |
Platen Spindle Swinging Stroke | mm | 50 | ||
Feed Rate of FGS | mm/min | 10 - 120 | ||
Stroke of FGS | mm | 405 | 555 | 710 |
EPD Wavelength | nm | 360 - 1100 | ||
Temperature Control Tolerance | ℃ | ± 2 | ||
Main Motor | kW | 11 | 17 | 23 |
Total Weight | kgf | 1800 | 2300 | 3500 |
Dimension (W×D×H) | mm | 1200×2150×2250 | 1780×3190×2550 | |
- All datas are subject to change without notice. Please verify details with Dyan.
Features
1. Disc Temperature Control System
Temperature Control System (DSTC) is designed to monitor and manage the temperature of the disc surface, on the touch screen. Learn More
2. Disc Turning System (DTS) (Optional)
The Disc Turning System (DTS), also called Facing & Grooving System (FGS), is commonly implemented in lapping models to linearly trim along the abrasive layer of lapping disc with a diamond bit. This is done to restore the flatness of the abrasive layer to its original condition. Learn More
3. Universal Platen
During operation, a pneumatic cylinder applies a consistent vertical force to the platen spindle. At the same time, the cylinder shaft is driven to rotate, allowing the workpiece to undergo finer cross-grinding, resulting in improved precision. Learn More
4. Oscillating Platen (Optional)
The oscillating platen (the process) facilitates a sequential, spiraling, cross-path processing route for the workpiece, resulting in exceptionally good flatness. Learn More
5. Air Bag Platen (P-ABP) (Optional)
Ponda’s air bag platen distributes pressure across the wafer surface in up to 6 distinct zones, allowing for precise control of planarization forces. Learn More
6. Versatile Clamping
The clamping method is selected based on the wafer’s adhesion methods. There are primarily two types of clamping: direct wafer vacuum clamping and vacuum clamping to a ceramic carrier bonded with wafers. Learn More
7. End Point Detector (EPD)
In-process end-point detectors are essential in chemical mechanical planarization (CMP) processes, actively monitoring the procedure in real-time. They specifically utilize variations in light emission, such as intensity or spectrum changes, to accurately signal the completion of the polishing layer. Learn More
8. Compatible with Both Lapping and Chemical Mechanical Polishing
Under the same equipment framework, both lapping and chemical mechanical polishing processes can be utilized. If there is a need to switch processing methods later, this can be achieved by replacing the abrasive disc and slurry to transition between lapping and chemical mechanical polishing processes. However, even if lapping and polishing equipment share the same framework, there are still slight differences in configuration. The most straightforward way to distinguish them is by examining the types of slurries and discs used, as well as checking whether the equipment is equipped with a Disc Turning System (DTS).
In common practice, polishing is essentially fine lapping or fine grinding, usually referred to as Mechanical Polishing. Hereby, we employ a Chemical-Mechanical Polishing method instead of relying solely on mechanical polishing, achieving a scratch-free, ultra-nanoscale surface roughness.
Flat Lapping
Flat lapping is a method used for achieving precise surface flattening. Essentially, this process is utilized to enhance the flatness and, in some instances, the smoothness of the item being worked on. The majority of lapping operations involve the use of a powder-slurry and a synthetic metal lapping plate. In specific scenarios, particularly hard materials, such as diamond, undergo dry lapping with abrasive powders. Less frequently, some processes might not use any powder or slurry at all, relying solely on the lapping plate.
When the hardness of the workpiece surpasses HRA 80, lapping can achieve a mirror-smooth surface. This is because the hard material partially neutralizes the abrasive’s effectiveness, leading to a fine removal of the workpiece’s surface that mimics the effect of polishing thus we call it lap-polishing.
Flat Polishing
Flat polishing is a process designed to improve surface roughness. It operates similarly to lapping on the same equipment but differs in the consumables applied. Most polishing processes involve applying a very fine powder slurry to a polishing pad, whereas lapping typically uses coarser powders and a synthetic metal plate. Polishing slurries are categorized into neutral, acid, and alkaline based on the solution’s pH value.
Under microscopic examination, acid and alkaline slurries work by gradually corroding and softening the object’s surface layer, transforming it into a thin film. This characteristic helps the polishing pad and powder to effortlessly remove the layer, achieving an ultra-fine roughness level. This technique is known as Chemical Mechanical Polishing.
Model Defination
PDS | Single Sided Wafer Lapping/Polishing |
700 · 855 · 1270 | Lapping/Polishing Disc Diameter |
2 · 4 | Number of Workstations |
C | Disc Chilling System |
E | EPD System |
L · P | Lapping · Polishing |
W | Swinging Platen |
- For multiple models with similar appearances, only a single model figure will be displayed.
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