Fully Automatic Wafer Grinder
The Fully Automatic Wafer Grinder utilizes dry-in-dry-out grinding mode and integrates numerous features. Meanwhile, the graphical user interface (GUI) screen enables real-time monitoring and control of all functional devices. The series is equipped with two sets of high-power air bearing spindles, responsible for rough and fine grinding respectively. By adapting to different grinding wheels, it can process wafers made from a variety of materials, at the meantime delivering the expected precision and long-term stability for wafer production.
Engineering Intents
Achieves fully automated wafer grinding: Wafer pick-and-place > Alignment and direction correction > Worktable cleaning > In-process thickness inspection > Coarse and fine grinding – Wafer cleaning and drying
The three vacuum worktables are driven by an aerostatic rotary platform
The work table can clamp up to 3 different sizes of wafers
Can be configured with a high-precision mechanical spindle or an aerostatic grinding spindle
Can be configured for fully automated TAIKO grinding
Specifications
Machine Model | PDG 2100 AT | PDG 2150 AT | PDG 2200 AT | PDG 2300 AT | |
|---|---|---|---|---|---|
Max. Clamping Diameter | mm | 100 (4 inches) | 150 (6 inches) | 200 (8 inches) | 300 (12 inches) |
Grinding Wheel Diameter | mm | 209 | 312 | ||
Grinding Rotation Rate | rpm | 500 - 3500 | |||
Worktable Rotation Rate | rpm | 10 - 450 | |||
Y-axis Feed Rate | μm/s | 0.1 - 80 | |||
Thickness Gauge Resolution | μm | 0.1 | |||
Acoustic Emission Frequency | kHz | 20 - 1000 | |||
Total Power | kW | 14 | 17 | 23 | |
Total Weight | kgf | 3200 | 3400 | 3500 | 4000 |
Dimension (W×D×H) | mm | 1350×3200×2000 | 1550 × 3630 × 2000 | ||
- All datas are subject to change without notice. Please verify details with Dyan.
Features
1. Microporous Ceramic Chuck Table
The ceramic material, sintered at high temperatures, forms uniform “ant-nest” structures for even vacuum force distribution, preventing wafer damage. It is 11.8% stronger than similar ceramics and integrated with the worktable’s sealing module for enhanced precision and stability. Learn More
2. DYAN-X Control Software
DYAN-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. Air Bearing Spindle
The air bearing grinding spindle uses dry, clean air through microporous layers to support the rotor shaft against the stator, enabling fast, smooth rotation without contact, ensuring exceptional accuracy and stability. Learn More
4. In-Machine Thickness Gauges
A high-precision thickness gauge ensures consistent grinding precision and accurate offset measurements for wheel wear. PONDA offers three options for monitoring wafer thickness under various grinding conditions. Learn More
Off Process Contact Gauge (OCG) (Not Available)
In Process Contact Gauge (ICG)
In Process Non-Contact Gauge (ING) (Optional)
5. Acoustic Emission (Optional)
A built-in Acoustic Emission (AE) system in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. Learn More
6. TAIKO Grinding (Optional)
After the TAIKO grinding process, the raised ring on the wafer’s back acts like a frame, reducing warpage and enhancing structural strength. Even with a wafer thickness as thin as 40 µm, operators can handle it by the ring without damage. Learn More
7. Bernoulli End Effector (Optional)
The Bernoulli end effector, almost no physical contact (a tiny support point, made of non-marking rubber, will come into contact with the wafer), leverages the effects of airflow to secure objects onto its surface. Learn More
Model Defination
PDG | Wafer Grinder |
2 | Two Grinding Spindles |
100 · 150 · 200 · 300 | Max. Clamping Diameter |
A · E | Air Bearing · Electric Spindle |
T | Equipped with Thickness Gauge |
- For multiple models with similar appearances, only a single model figure will be displayed.
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