Fully Automatic Wafer Grinding Polisher
The Fully Automatic Wafer Grinding Polisher maintains the dry-in-dry-out grinding mode and is specifically integrates Stress Relief System. This system effectively reduces the risk of wafer transfer between the grinding and polishing stages and achieves an epi-ready condition on independent equipment. Additionally, the Stress Relief System minimizes wafer stress non-uniformity, enhancing the wafer’s toughness and reducing the risk of chipping during the back grinding process. Furthermore, the stress relief system can be tailored to the wafer material, offering a choice between dry polishing and CMP polishing for wider applicability.
Engineering Intents
Enables all-in-one, fully automatic grinding and stress-free processing
Stress-free processing can be selected as DP (Dry Polishing) or CMP (Chemical Mechanical Polishing)
The four vacuum chucks are driven by an The four vacuum chucks are driven by an aerostatic rotary platform
Configured with a non-contact Bernoulli end effector
The stress relief zone and the grinding zone are isolated
The surface roughness Sa of the output silicon wafer after CMP processing can be less than 0.1 nanometers, and the flatness can be less than 1 micrometer.
Specifications
Machine Model | PDG 3200 AT | PDG 3300 AT | |
|---|---|---|---|
Max. Clamping Diameter | mm | 200 (8 inches) | 300 (12 inches) |
Grinding Wheel Diameter | mm | 312 | |
Stress Relief Wheel Diameter | mm | 450 | |
Grinding Rotation Rate | rpm | 500 - 3500 | |
Stress Relief Rotation Rate | rpm | 200 - 1000 | |
Worktable Rotation Rate | rpm | 10 - 450 | |
Y-axis Feed Rate | μm/s | 0.1 - 80 | |
Thickness Gauge Resolution | μm | 0.1 | |
Acoustic Emission Frequency | kHz | 20 - 1000 | |
Total Power | kW | 33 | 37 |
Total Weight | kgf | 7500 | 7900 |
Dimension (W×D×H) | mm | 1980×3200×2000 | 1980×3650×2000 |
- All datas are subject to change without notice. Please verify details with Dyan.
Features
1. Microporous Ceramic Chuck Table
The ceramic material, sintered at high temperatures, forms uniform “ant-nest” structures for even vacuum force distribution, preventing wafer damage. It is 11.8% stronger than similar ceramics and integrated with the worktable’s sealing module for enhanced precision and stability. Learn More
2. DYAN-X Control Software
DYAN-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. Air Bearing Spindle
The air bearing grinding spindle uses dry, clean air through microporous layers to support the rotor shaft against the stator, enabling fast, smooth rotation without contact, ensuring exceptional accuracy and stability. Learn More
4. Stress Relief System
The Stress Relief System is an additional process station featured in the triple-spindle model, specifically designed to reduce the internal stress within wafers, thereby enhancing the yield of wafer processing. Learn More
5. In-Machine Thickness Gauges
A high-precision thickness gauge ensures consistent grinding precision and accurate offset measurements for wheel wear. DYAN offers three options for monitoring wafer thickness under various grinding conditions. Learn More
Off Process Contact Gauge (OCG) (Not Available)
In Process Contact Gauge (ICG)
In Process Non-Contact Gauge (ING) (Optional)
6. Acoustic Emission (Optional)
A built-in Acoustic Emission (AE) system in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. Learn More
7. Bernoulli End Effector (Optional)
The Bernoulli end effector, almost no physical contact (a tiny support point, made of non-marking rubber, will come into contact with the wafer), leverages the effects of airflow to secure objects onto its surface. Learn More
Model Defination
PDG | Wafer Grinder |
3 | One Stress Relief Spindle + Two Grinding Spindles |
200 · 300 | Max. Clamping Diameter |
A · E | Air Bearing · Electric Spindle |
T | Equipped with Thickness Gauge |
- For multiple models with similar appearances, only a single model figure will be displayed.
Get us in touch
- If you’re unsure which equipment best suits your needs, we’re here to help.
Why partner with us?
Partnering with us means gaining access to reliable, precision-engineered grinding and polishing solutions. With extensive industry experience and a commitment to quality, we provide expert support and equipment tailored to meet your specific needs.
Follow us on social media
How to choose the right equipment
- We offer insights into the equipment's performance across various use cases.
- Discover how our grinding and polishing machines are used across various industries.
- If you’re unsure which equipment best suits your needs, we’re here to help.