Wafer Grinding Wheels

Superior Material Removal Efficiency

Flat lapping is a process that flattens the surface of the workpiece while also improving its roughness to a certain extent. Almost all lapping processes utilize a liquid containing abrasive particles and a lapping disc as the abrasive medium. However, in special cases, such as when working with diamond materials, dry diamond abrasive particles or even just a dry diamond lapping disc may be used for lapping.

Dyan, with its expertise in lapping and polishing, can create hundreds of process recipes by combining different abrasive media to cater to the processing of numerous different workpiece materials.

Ultra-Fine Surface Roughness

The proprietary abrasive grain size and optimized matrix ensure that the grinding process achieves ultra-low surface roughness. This results in a polished wafer surface that meets stringent requirements for downstream processing, minimizing the need for additional finishing steps.

Easy Cleaning and Waste Removal

DYAN’s grinding wheels incorporate innovative anti-clogging properties that prevent debris buildup during the grinding process. Waste particles can be effortlessly cleaned off, reducing downtime and ensuring smoother operation, which is especially crucial in environments requiring high cleanliness standards.