What can we do in Electronic Device industry?
DYAN Grinding’s machines are ideal for processing a wide range of electronic components, including battery thermal insulation plates, display panels, SIM card trays, camera trays, and more. Their grinding, lapping, and polishing equipment ensures that these parts meet the stringent requirements for precision, surface quality, and dimensional accuracy required for the optimal performance of smartphones and other electronic devices.
Applicable Processes
Examples: Screens for smartphones, tablets, and other electronic devices.
DYAN Equipment: Single-Sided and Double-Sided Grinding Machines
Process: Grinding and thinning to reduce the thickness of display panels while maintaining surface quality and precision.
Examples: Camera lenses used in smartphones, digital cameras, and other devices.
DYAN Equipment: Multi-Axis Ultra-Precision Grinding and Polishing Machines, Flat Lapping Machines
Process: Grinding and polishing to achieve smooth, optical-quality surfaces required for high-precision spherical and aspherical lenses, or lapping for flat lenses.
Examples: Trays used in smartphones and other devices to hold SIM cards.
DYAN Equipment: Single-Sided Grinding Machines
Process: Precision grinding and surface finishing to ensure the trays fit accurately and securely within the device.
Examples: Silicon wafers used in smartphone processors, memory chips, and sensors.
DYAN Equipment: Wafer Grinders and Lapping Machines
Process: Wafer thinning, lapping, and polishing to ensure uniform thickness and surface finish for high-performance chips.
Examples: MEMS sensors used in smartphones (e.g., accelerometers, gyroscopes).
DYAN Equipment: Wafer Grinders and Lapping Machines
Process: Wafer thinning and lapping to achieve precise thickness and surface finish for MEMS components, ensuring their proper functioning.
Examples: Thermal insulation plates used in batteries to manage heat dissipation in smartphones, laptops, and electric vehicles.
DYAN Equipment: Single-Sided and Double-Sided Lapping Machines
Process: Lapping and grinding to achieve high flatness and surface quality, ensuring the plates function effectively for thermal management in battery systems.
Examples: Substrates, conductive traces, and other components on PCBs.
DYAN Equipment: Flat Grinding and Polishing Machines
Process: Grinding and polishing for flatness, surface finishing, and preparing components for soldering or further assembly.
Examples: Check valves, ball valves, gate valves.
DYAN Equipment: Single-Sided and Double-Sided Grinding Machines
Process: Grinding and lapping to achieve flat sealing surfaces and proper functioning, reducing the risk of leakage.
Examples: Trays that house smartphone cameras, ensuring proper alignment and stability.
DYAN Equipment: Grinding and Polishing Machines
Process: Surface grinding and polishing to ensure smooth finishes, accurate dimensions, and secure mounting for camera modules.
