Fully Automatic Wafer Wax Mounter
Wax Mounter is primarily used for bonding one side of wafers, such as gallium nitride (GaN), gallium arsenide (GaAs), sapphire, and silicon carbide (SiC), to ceramic carrier prior to single-sided grinding and CMP polishing. The equipment integrates the processes of loading, transporting, heating, waxing, cooling, and pressing into a fully automated system, simplifying the wafer wax mounting process and improving the yield.
Engineering Intents
Achieves fully automated bonding: heating, waxing, mounting, chilling
3 independent temperature-controlled workstations
Independent wafer tray to prevent burns
Water-chilled pressurized cooling tower
Wafer handling robot with vacuum suction cups
Carrier handling robot
Specifications
| Machine Model | Unit | PDM 305 AW | PDM 360 AW | PDM 420 AW | PDM 585 AW |
|---|---|---|---|---|---|
| Lapping (Polishing) Disc Diameter | pcs | 10 | 12 | - | |
| Capacity of 4-inch (50 mm) | - | 5 | 6 | 7 | 11 |
| Capacity of 6-inch (150 mm) | - | 1 | 3 | 4 | 7 |
| Capacity of 8-inch (200 mm) | - | 1 | 1 | 3 | 5 |
| Ceramic Carrier Diameter | mm | 305 | 360 | 420 | 585 |
| Carrier Heating Range | °C | 60 – 180 | |||
| Wax Heating Temperature | °C | 100 ± 3 | |||
| Heating Duration (130 ± 3 °C) | sec | 230 | 260 | 295 | 385 |
| Chilling Duration (30 ± 3 °C) | sec | 140 | 165 | 195 | 270 |
| Temperature Control Accuracy | °C | ± 3 | |||
| Compress Pressure (0.6 MPa) | kgf | 200 ± 3 | 250 ± 3 | 305 ± 3 | 455 ± 3 |
| Bonding TTV | µm | ≤ 5 | |||
| Wax Dispensing Accuracy | g | ± 0.2 | |||
| Total Power | kVA | 7 | 10 | 14 | 26 |
| Total Weight | kgf | 1050 | 1120 | 1200 | 1450 |
| Dimension (W×D×H) | mm | 1550×1550×1900 | 2150×2050×1990 | ||
- All datas are subject to change without notice. Please verify details with Dyan.
Features
Model Defination
| PDC | Wafer Edge Grinder |
| 2 | Twin Grinding Spindle |
| 100 · 150 · 200 · 300 | Max. Clamping Diameter |
| E | Electric Spindle |
- For multiple models with similar appearances, only a single model figure will be displayed.
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Why partner with us?
Partnering with us means gaining access to reliable, precision-engineered grinding and polishing solutions. With extensive industry experience and a commitment to quality, we provide expert support and equipment tailored to meet your specific needs.
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