Fully Automatic Wafer Edge Grinder
The Wafer Edge Grinder (Wafer Bevelling or Wafer Chamfering Machine) adopts a dry-in-dry-out processing mode, integrating a range of advanced technologies such as CCD defect analysis system, dual-fluid wafer cleaner, sensor cassette docks, and orientation grinding system. The equipment additionally features four cassette docks and one defect wafer dock specifically designed for the segregation of defective and non-defective wafers. Such design minimizes the frequency of cassette loading procedure. In comparison, the mechanical performance and structural logic design of the equipment contribute to surpassing the efficiency and accuracy of most comparable machines within the market.
Engineering Intents
Achieves fully automated wafer grinding: Wafer pick-and-place > Alignment and direction correction > Initial inspection > Edge coarse and fine grinding > Wafer cleaning and drying > Post-processing inspection > Sorting
Coarse and fine grinding can be completed at separate stations without moving the wafer
Coarse and fine grinding of the orientation flat and notch
CCD vision system inspects wafer diameter, roundness, and bevel angle
Sorting of qualified and rejected defective wafers
Specifications
Machine Model | PDC 2100 AT | PDC 2150 AT | PDC 2200 AT | PDC 2300 AT | |
|---|---|---|---|---|---|
Max. Clamping Diameter | mm | 100 (4 inches) | 150 (6 inches) | 200 (8 inches) | 300 (12 inches) |
Processable Orientation (Double Sided) | P100/111 N100/111 V-Notch | ||||
Edge Beveling Wheel Diameter | mm | 202 | |||
Edge Beveling Spindle Power | kW | 1 | 1.5 | ||
Edge Beveling Rotation Rate | rpm | 500 - 3000 | |||
Worktable Rotation Rate | rpm | 0 - 400 | |||
Notch/Flat Beveling Rotation Rate | rpm | 40000 - 60000 | |||
Z-axis Stroke | mm | 50 | |||
Feed Rate | μm/s | 0.5 - 1000 | |||
Thickness Gauge Resolution | μm | 0.5 | |||
Total Power | kW | 5 | 5.5 | ||
Total Weight | kgf | 1000 | 1100 | 1300 | 1400 |
Dimension (W×D×H) | mm | 2000×1150×1950 | |||
- All datas are subject to change without notice. Please verify details with Dyan.
Features
1. Advantages of Edge Grinding (Beveling / Chamfering)
Prevent wafer edge chipping. During the manufacturing of wafers, they are often impacted by robot arms, which could cause edge breakage(chipping) and form areas of stress concentration. These areas of stress concentration could continuously release contaminating particles during usage, thereby affecting the product yield.
Prevent thermal stress concentration. Wafers undergo numerous high-temperature processes during usage, such as oxidation and diffusion. When the thermal stress generated by these processes exceeds the strength of the wafer lattice, dislocation and stacking faults will occur. Edge grinding can exactly avoid these defects at the edge of the wafer.
Increase the flatness of the epitaxial layer and photoresist layer at the edge of the wafer. In epitaxial processes, the growth rate of the sharp angle region is higher than that of the plane. Therefore, using an unrounded wafer is likely to produce protrusions at the edge. Similarly, when using a spin coater to apply photoresist, the photoresist solution may accumulate at the edge of the wafer, affecting the accuracy of mask alignment.
2. DYAN-X Control Software
DYAN-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. CCD Inspection and Detection System (CID)
The equipment features a high-precision CCD visualized inspection system, utilized for both alignment and detecting defects. Learn More
4. CCD Angularity Inspection (Optional)
CCD angle detection involves using a high-resolution CCD camera to inspect the angularity of the chamfered edge of wafers. Learn More
5. Notch and Flat Grinding (Optional)
The notch and flat features are essential for wafer alignment, enabling automated machinery to accurately position the wafer during processing. They act as reference markers for wafer orientation, allowing precise handling by providing clear alignment indicators.
Therefore, the notch and flat grinding must achieve a high degree of precision to ensure correct positioning in subsequent manufacturing steps.
Model Defination
PDC | Wafer Edge Grinder |
2 | Two Beveling Spindles |
100 · 150 · 200 · 300 | Max. Clamping Diameter |
E | Electric Spindle |
T | With Thickness Gauge |
- For multiple models with similar appearances, only a single model figure will be displayed.
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Partnering with us means gaining access to reliable, precision-engineered grinding and polishing solutions. With extensive industry experience and a commitment to quality, we provide expert support and equipment tailored to meet your specific needs.
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