Standard Double Sided Lapping Machine

The standard double sided lapping & polishing machine is designed for products that require a high level of roughness and flatness, but have relatively low parallelism requirements in comparison to advanced class. Notable examples of such products include faucet valves, SIM card tray pins, tender LED substrates, and transmission clutches.

Engineering Intents

Double-sided lapping and polishing of the product

Equipped with pneumatic pressurization unit, with optional hydraulic pressurization

Products are nested in planetary carrier, rotating while orbiting

The flatness and parallelism of the processed product are within 10 microns

Equipped with touchscreen

Double Sided Lapping Machine Work Station
Double Sided Lapping Machine Work Station

Specifications

Machine ModelUnitPDB 65 LSPDB 95 LSPDB 136 LS
Diameter of Upper & Lower Disc (OD × ID)mm376 × 158635 × 235965 × 395
Max. Diameter of Workpiecemm125210300
Number of Planet Wheelmm3 ≤ n ≤ 53 ≤ n ≤ 6
Min. Processable Thicknessmm0.2 ≤ t ≤ 200.2 ≤ t ≤ 30
Disc Rotation Raterpm0 – 600 – 50
Planet Wheel Specification
DP12 Z=66 α=20°DP12 Z=108 α=20°DP12 Z=152 α=20°
Main MotorkVA0.45.57.5
Auxiliary MotorkVA0.1250.61.5
Total Weightkgf150020002700
Dimension (W×D×H)mm750×1020×1930960×1350×21901340×1690×2650

Features


1. Machine Housing (Optional)

PDN6103LFP-Flat-Lapping-Machine-with-Casing-300x300.webp

Flat lapping machine with protective casingIn a high-cleanliness environment, the Dust Proof Housing isolates the internal environment from the external surroundings, thereby protecting both the processing environment and the facility environment. Under this protection, it effectively prevents particles generated during facing and grooving or external dust particles from entering the polishing center and scratching the workpiece.

To address the issue of slury evaporation and potential contamination caused by rising temperatures during processing, the housing ceiling is equipped with an exhaust vent, which can be connected to the facility’s exhaust system.

2. Compatible with Both Lapping and Chemical Mechanical Polishing

Under the same equipment framework, both lapping and chemical mechanical polishing processes can be utilized. If there is a need to switch processing methods later, this can be achieved by replacing the abrasive disc and slurry to transition between lapping and chemical mechanical polishing processes. However, even if lapping and polishing equipment share the same framework, there are still slight differences in configuration. The most straightforward way to distinguish them is by examining the types of slurries and discs used, as well as checking whether the equipment is equipped with a Disc Turning System (DTS).

In common practice, polishing is essentially fine lapping or fine grinding, usually referred to as Mechanical Polishing. Hereby, we employ a Chemical-Mechanical Polishing method instead of relying solely on mechanical polishing, achieving a scratch-free, ultra-nanoscale surface roughness.


Flat Lapping

Lapping-Plate-Diagram.webp

Flat lapping is a method used for achieving precise surface flattening. Essentially, this process is utilized to enhance the flatness and, in some instances, the smoothness of the item being worked on. The majority of lapping operations involve the use of a powder-slurry and a synthetic metal lapping plate. In specific scenarios, particularly hard materials, such as diamond, undergo dry lapping with abrasive powders. Less frequently, some processes might not use any powder or slurry at all, relying solely on the lapping plate.

When the hardness of the workpiece surpasses HRA 80, lapping can achieve a mirror-smooth surface. This is because the hard material partially neutralizes the abrasive’s effectiveness, leading to a fine removal of the workpiece’s surface that mimics the effect of polishing thus we call it lap-polishing.

Flat Polishing

Polishing-Plate-Diagram.webp

Flat polishing is a process designed to improve surface roughness. It operates similarly to lapping on the same equipment but differs in the consumables applied. Most polishing processes involve applying a very fine powder slurry to a polishing pad, whereas lapping typically uses coarser powders and a synthetic metal plate. Polishing slurries are categorized into neutral, acid, and alkaline based on the solution’s pH value.

Under microscopic examination, acid and alkaline slurries work by gradually corroding and softening the object’s surface layer, transforming it into a thin film. This characteristic helps the polishing pad and powder to effortlessly remove the layer, achieving an ultra-fine roughness level.


Model Defination

PDBDouble Sided Lapping & Polishing
6 · 9 · 13Disc Diameter
5 · 6Number of Carrier
L · PLapping · Polishing

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