Sample Records

We offer a range of grinding and polishing solutions that deliver precise and high-quality results. Our samples highlight the performance of our equipment in industries like semiconductors, electronics, optics, and more. From flat grinding to ultra-precision optics polishing and wafer thinning, our products are designed to meet the specific needs of your projects.

Wafering Samples


Material

Process Applied

Dimension

Target Thickness

TTV

Rough. Sa.





(inch)

(micron)

(micron)

(nm)

Silicon Carbide

Rough Grinding
Fine Grinding

6

150

2.472

1.420


Silicon Carbide

Wax Bonding
Rough Grinding
Fine Grinding
CMP

6

200

2.648

0.193


Gallium Nitride

Rough Grinding
Fine Grinding
CMP

4

300

2.181

0.963


Germanium

Rough Grinding
Fine Grinding
CMP

4

145

2.905

0.256


Sapphire

Wax Bonding
Rough Grinding
Fine Grinding
CMP

4

400

2.315

0.938


Gallium Arsenide

Back Taping
Rough Grinding
Fine Grinding

4

55

2.240

5.062


Silicon

Rough Grinding
Fine Grinding

12

300

2.782

10.065


Piezo Ceramic

Wax Bonding
Rough Grinding

2

50

1.651

32.468


Silicon

Rough Grinding
Fine Grinding

8.839 (M4)

110

3.188

13.427


Silicon

Taiko Rough Grinding
Taiko Fine Grinding

12

50

0.887

4.361


Silicon

Rough Grinding
Fine Grinding

4

5

0.654

2.695


Notice

  • TTV - Total Thickness Variation
  • CMP - Chemical Mechanical Planarization
  • Only the most common parameters are presented.
  • Please contact us for detailed parameters.

Measurement Instruments

  • Geometry - WD4000 Geometrical White Light Interferometer
  • Surface - SuperView W1 Surface White Light Interferometer
geometric interference patterns on silicon
Color gradient geometric map of wafer thickness measurements

Single Sided Lapping and Polishing Samples


Material

Application

Process

Dimension

Flatness

Parallelity

Rough. Sa.


(mm)

(micron)

(micron)

(nm)

Coated Cooper

Valve Plate

Lapping

Φ148×8

1.974

16.021

NR

Tungsten Carbide
and Cobalt

Machining Bits

Lapping

Various

1.243

NR

NR

Stainless Steel
304

Slide Seal

(convex)
Lapping
Polishing

36×6×5.5

1.695

NR

8.662

Plated Gold
And Resin

IC Package
Substrate

Grinding
Lapping

240×96×2.35

3.493

34.746

NR

Aluminum
6065 Alloy

Pump Plate

Lapping

Φ36.6×7.95

1.562

NR

NR

Glass

Solar Panel

Lapping
Polishing

120×120×4

2.315

9.258

12.748

Titanium Alloy

Aero Engine
Casings

Lapping

Φ862×522

7.515

NR

18.193

Stacked Glass

Holographic
Display

Lapping
Polishing

Φ685×22

10.3

47.521

5.466









Abbreviations

  • MCR - Micron or Micrometer
  • NR - Not Required
  • Only the most common parameters are presented.
  • Please contact us for detailed parameters.

Measurement Instruments

  • Geometry - Mizar Gold Coordinate Measuring Machine (CMM)
  • Surface - SuperView W1 Surface White Light Interferometer

Double Sided Lapping and Polishing Samples


Material

Application

Process

Dimension

Flatness

Parallelity

Thick. Vari.

Rough. Sa.


(mm)

(micron)

(micron)

(micron)

(nm)

Alumina

Air Seal Ring

Lapping

Φ82×5.5

1.487

1.653

4.841

NR

Stainless
Steel 304

Automotive
Component

Lapping
Polishing

Φ80×4.75

2.347

2.815

5.642

16.374

Stainless
Steel 316

Pump Plate

Lapping

Φ232×47

1.775

2.656

4.147

NR

SUS 304
with Cooper

Valve Plate

Lapping

Φ173×8

2.886

3.132

8.667

NR

Polyurethane

Valve Pad

Lapping

Φ260×0.77

2.835

2.989

NR

NR

Carbide
Metal

Pump Hatch

Lapping

Φ103×4.05

1.823

2.138

1.985

NR

Zirconia

Fingerprint
Film

Lapping
Polishing

Φ52×0.8

1.583

1.973

2.112

4.349

Aluminum
7075

Gauge
Block

Lapping
Polishing

33×18×6

0.313

0.524

0.749

12.845

Abbreviations

  • MCR - Micron or Micrometer
  • NR - Not Required
  • Only the most common parameters are presented.
  • Please contact us for detailed parameters.

Measurement Instruments

  • Geometry - Mizar Gold Coordinate Measuring Machine (CMM)
  • Surface - SuperView W1 Surface White Light Interferometer