Semi-Automatic Wafer Grinder
The semi-automatic grinder features a more compact body design and is typically used in laboratory and light production line scenarios. The grinding center serves as the core unit for all grinder series, employing a frame made of granite material. Coupled with our independently developed high-power air bearing spindle and unique stroke mechanism, the machine can deliver high-quality surface results and precision.
Engineering Intents
Laboratory-friendly equipment size
Cast iron and marble combined machine body
Configurable with either a high-precision mechanical spindle or an aerostatic grinding spindle
Spindles of different power are configured for different materials
The worktable can clamp up to 3 different sizes of wafers
High stability enables a minimum grinding thickness of 5 micrometer
Specifications
Machine Model | PDG 1100 SAT | PDG 1150 SAT | PDG 1200 SAT | PDG 1300 SAT | |
|---|---|---|---|---|---|
Max. Clamping Diameter | mm | 100 (4 inches) | 150 (6 inches) | 200 (8 inches) | 300 (12 inches) |
Grinding Wheel Diameter | mm | 209 | 312 | ||
Grinding Rotation Rate | rpm | 500 - 3500 | |||
Worktable Rotation Rate | rpm | 10 - 450 | |||
Y-axis Feed Rate | μm/s | 0.1 - 80 | |||
Thickness Gauge Resolution | μm | 0.1 | |||
Acoustic Emission Frequency | kHz | 20 - 1000 | |||
Total Power | kW | 8.3 | 11 | 14 | |
Total Weight | kgf | 1700 | 1760 | 1920 | |
Dimension (W×D×H) | mm | 1125×1350×2250 | |||
- All datas are subject to change without notice. Please verify details with Dyan.
Features
1. Microporous Ceramic Chuck Table
The ceramic material, sintered at high temperatures, forms uniform “ant-nest” structures for even vacuum force distribution, preventing wafer damage. It is 11.8% stronger than similar ceramics and integrated with the worktable’s sealing module for enhanced precision and stability. Learn More
2. DYAN-X Control Software
DYAN-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. Air Bearing Spindle (Optional)
The air bearing grinding spindle uses dry, clean air through microporous layers to support the rotor shaft against the stator, enabling fast, smooth rotation without contact, ensuring exceptional accuracy and stability. Learn More
4. In-Machine Thickness Gauges
A high-precision thickness gauge ensures consistent grinding precision and accurate offset measurements for wheel wear. PONDA offers three options for monitoring wafer thickness under various grinding conditions. Learn More
Off Process Contact Gauge (OCG)
In Process Contact Gauge (ICG) (Optional)
In Process Non-Contact Gauge (ING) (Optional)
5. Acoustic Emission (Optional)
A built-in Acoustic Emission (AE) system in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. Learn More
6. TAIKO Grinding (Optional)
After the TAIKO grinding process, the raised ring on the wafer’s back acts like a frame, reducing warpage and enhancing structural strength. Even with a wafer thickness as thin as 40 µm, operators can handle it by the ring without damage. Learn More
Model Defination
PDG | Wafer Grinder |
1 · 2 | One Grinding Spindle · Two Grinding Spindle |
100 · 150 · 200 · 300 | Max. Clamping Diameter |
S | Semi Automatic |
A · E | Air Bearing · Electric Spindle |
T | Equipped with Thickness Gauge |
- For multiple models with similar appearances, only a single model figure will be displayed.
Get us in touch
- If you’re unsure which equipment best suits your needs, we’re here to help.
Why partner with us?
Partnering with us means gaining access to reliable, precision-engineered grinding and polishing solutions. With extensive industry experience and a commitment to quality, we provide expert support and equipment tailored to meet your specific needs.
Follow us on social media
How to choose the right equipment
- We offer insights into the equipment's performance across various use cases.
- Discover how our grinding and polishing machines are used across various industries.
- If you’re unsure which equipment best suits your needs, we’re here to help.