Honors and Certificates
Following the notable success of its collaboration project with Tsinghua University, Dyan swiftly gained prominence for its exceptional professional capabilities. From that time until 2014, Dyan received favorable attention and cooperation invitations from over twenty of China's top universities. In the subsequent decade, these collaborative projects focused on civilian technology made significant contributions to society.
By the end of 2020, our company had accomplished significant milestones in innovation and compliance. We successfully acquired 20 remarkable inventions out of a pool of 36, showcasing our commitment to research and development.
Additionally, we were honored to receive the National High-Tech Enterprise Certificate twice, reflecting our technological prowess and industry recognition. Furthermore, we qualified with the ISO 9001:2015 standards and obtained the Bureau Vitas Certificate, demonstrating our adherence to rigorous quality control and regulatory requirements. These achievements underscore our dedication to continuous improvement and excellence in all aspects of our operations.
Honors | ||
|---|---|---|
National High-Tech Enterprise | ||
Central South University Honored Joint Laboratory | ||
Amoiensis University Honored Joint Laboratory | ||
National Key Research and Development Program of China | ||
Certificates | Year of Validation | |
Bureau Vitas Certificate | 2022 | |
ISO 9001:2015 Certificate | 2016 | |
Honored Institutions | Since | Project Name |
Tsinghua University | 2009 | Ultra-Fine Polished Molybdenum Disc |
Peking University | 2011 | Top-contacts of Magnetic Ring Flat Lapping |
Beijing Normal University | 2011 | Mineral Substrate Grinding |
Beijing Institute of Technology | 2011 | Ultra-thin Biochip Wafer Grinding |
Beihang University | 2014 | Lidar Reflector Lapping, Finishing and Polishing |
Dalian University of Technology | 2015 | Ultra-precision Squared Gauge Block Grinding |
Amoiensis University | 2016 | Aspherical Lens Grinding, Finishing and Polishing |
Shenzhen University | 2018 | Ultra-thin Piezoelectric Ceramic Plate |
Central South University | 2018 | Satellite Solar Panel Grinding |
N.C. Electric Power University | 2019 | Reactor Container Sealing |
Nanchang University | 2020 | Silicon Carbide Wafer Grinding and CMP |
Soochow University | 2020 | Ultra-thin Silicon Wafer Grinding (TAIKO) |
- Last Updated: September 2023