Company Journey
1999 - 2006
Dyan, originally a manufacturer specializing in pharmaceutical equipment, had its founder, Dr. Hwu, keenly foresee the future of the grinding equipment market during a chance encounter. Driven by his ambitious aspirations, Dr. Hwu successfully independently developed China's first flat lapping machine and delivered this achievement to the first client, Nokia. This landmark achievement not only showcased Dyan's technical prowess but also paved the way for the company to venture into the abrasion equipment market.
2007 - 2011
Dyan, formally founded in 2007, soon thereafter received a collaboration proposal from Tsinghua University. Dyan's impeccable execution of the Tsinghua project propelled the company to instant fame, attracting a flurry of collaboration initiatives from numerous universities and research institutes. A particular highlight was the success of the ultra-thin semiconductor wafer polishing conceptional project, which involved polishing 2-inch silicon wafers down to a thickness of 22 micrometers (μm). This achievement cemented Dyan's belief in the promising future of semiconductor development.
2012 - 2017
Dyan embarked on the development of specialized grinding machines and Chemical Mechanical Planarization (CMP) machines for semiconductor wafers. Concurrently, with the rise of the smartphone industry, the company developed grinding and polishing technologies for curved screens, middle frames, and backplates, and introduced a specialized brush buffing machine. These innovations were well-received by tier-one suppliers to Apple such as Everwin Precision and Foxconn. In the smartphone repair market, these devices also gained popularity.
2018 - 2023
Dyan's first self-developed fully automatic wafer grinder successfully completed its initial batch processing and was delivered to end user. The company simultaneously received recognition from the customer along with an order. Remarkably, the time period from the completion of the equipment to securing the order took only two weeks. This undoubtedly boosted the company's confidence in the prospects of the wafer manufacturing industry. Taking advantage of this momentum, the company announced plans to develop fully automatic wafer grinding polisher and optical ultra-precision grinding and polishing equipment.
Corporate Philosophy
Today's remarkable achievements stem from the powerful impetus fueled by our unwavering corporate philosophy. This philosophy not only guides us in our relentless pursuit of progress but also inspires every member of our team, fostering growth amidst challenges and fostering continuous innovation in competition. Together, we are writing our own chapter of success.
Our Vision
To redefine the equipment manufacturing technology landscape by pioneering cutting-edge solutions that revolutionize industries, fostering a culture of innovation, sustainability, and excellence, and securing our position as the global leader in advanced engineering and manufacturing technologies.
Our Mission
To empower our clients with unparalleled equipment and technology solutions that enhance productivity, efficiency, and quality, nurturing a dynamic environment of continuous improvement, integrity, and customer-centric innovation, ensuring we meet and exceed their evolving needs and expectations.
Our Values
To uphold honesty, respect, and collaboration as the cornerstone of our operations, fostering an inclusive workplace where diversity thrives, teamwork flourishes, and excellence is the norm, driving our commitment to ethical practices, social responsibility, and sustainable growth in everything we do.